Enhancing Heat Transfer in Heat Pipes through Controlled Vibration
Cooling electronic chips and hardware is essential to their safe and reliable operation. Heat pipes are devices that transfer heat between a source and a sink through a phase change process. In this project, the performance of the state-of-the-art heat pipe designs is enhanced through artificially created body force fields that are controlled by vibration and/or centrifugal rotation.
The aim is to improve the heat transfer characteristics of the heat pipes to improve their capabilities to cool down processors and computer components, reducing their size and carbon footprint.